We’re QuantumDiamonds, and we develop and deploy quantum-sensing tools for semiconductor testing. Our focus is the hard part of chip manufacturing: seeing and understanding defects that are otherwise invisible - especially as packaging stacks become more complex. On the day-to-day side, we build metrology and analysis platforms that let customers capture high-resolution, non-destructive measurements across advanced chip structures, and then turn that raw sensing data into decision-ready insights.
From our work in the lab to integration in customer workflows, we support failure analysis and metrology for the advanced packaging era. We also offer in-house failure analysis using quantum sensing as a service, alongside stand-alone quantum sensors for industrial use. We were founded as a spin-off from TU Munich, and we operate with teams of physicists, engineers, and data scientists who work closely with customers worldwide to push chipmaking forward.
